kw.\*:("Voids")
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Improved light output power of LEDs with embedded air voids structure and SiO2 current blocking layerSHENGJUN ZHOU; SHU YUAN; SHENG LIU et al.Applied surface science. 2014, Vol 305, pp 252-258, issn 0169-4332, 7 p.Article
Effect of oxygen precipitation on voids in bulk siliconXUEGONG YU; DEREN YANG; XIANGYANG MA et al.Microelectronic engineering. 2003, Vol 66, Num 1-4, pp 289-296, issn 0167-9317, 8 p.Conference Paper
On the Utility of Microscopy and C-Scan Techniques in the Study of Defects Arising From Resin Infusion Process and a Study on the Influence of Voids on the Impact Behavior of CFRP Composites = Vom Nutzen mikroskopischer und C-Bild-Verfahren bei der Untersuchung von Defekten, die durch das Harzinfusionsverfahren entstehen und eine Untersuchung des Einflusses von Lunkern auf das Impactverhalten von CFK-VerbundwerkstoffenSURESH KUMAR, M; AMBRESHA; RANGANATH, V. R et al.Praktische Metallographie. 2014, Vol 51, Num 5, pp 353-366, issn 0032-678X, 14 p.Article
Micromechanics-based model for trends in toughness of ductile metalsPARDOEN, T; HUTCHINSON, J. W.Acta materialia. 2003, Vol 51, Num 1, pp 133-148, issn 1359-6454, 16 p.Article
Effects of heating atmosphere and steel chemistry on delamination of the surface layer of aluminized steelMAKI, Jun; SUEHIRO, Masayoshi.Surface & coatings technology. 2012, Vol 206, Num 19-20, pp 3869-3874, issn 0257-8972, 6 p.Article
Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositingJINGLIN BI; HUIQIN LING; ANMIN HU et al.Applied surface science. 2011, Vol 257, Num 8, pp 3723-3727, issn 0169-4332, 5 p.Article
1,8,14,20-Tetraoxa-11,23-dithiatricyclo[21.3.0.09,13]hexacosa-9,12,21,24-tetraeneWAGNER, Pawel; LAPKOWSKI, Mieczyslaw; KUBICKI, Maciej et al.Acta crystallographica. Section C, Crystal structure communications. 2006, Vol 62, issn 0108-2701, o155-o156, 4Article
Vapor pressure and void size effects on failure of a constrained ductile filmGUO, T. F; CHENG, L.Journal of the mechanics and physics of solids. 2003, Vol 51, Num 6, pp 993-1014, issn 0022-5096, 22 p.Article
High quality voids free oxide depositionPAI, C. S.Materials chemistry and physics. 1996, Vol 44, Num 1, pp 1-8, issn 0254-0584Article
Kinetics of isothermal annealing of vacancy voidsVITOL', E. N.Physics of metals and metallography. 1992, Vol 74, Num 2, pp 142-143, issn 0031-918XArticle
Polyvoids: Analytical Tool for Superpave HMA DesignSANCHEZ-LEAL, Freddy J; GARNICA ANGUAS, Paul; LARREAL, Michael et al.Journal of materials in civil engineering. 2011, Vol 23, Num 8, pp 1129-1137, issn 0899-1561, 9 p.Article
On the influence of void clusters on void growth and coalescence during ductile fractureBANDSTRA, J. P; KOSS, D. A.Acta materialia. 2008, Vol 56, Num 16, pp 4429-4439, issn 1359-6454, 11 p.Article
Effect of the hydrogen induced degradation of steel on the internal friction spectraLUNARSKA, E; OSOSKOV, Y; JAGODZINSKI, Y et al.Journal de physique. IV. 1996, Vol 6, Num 8, pp C8.59-C8.62, issn 1155-4339Conference Paper
Vacuum : a void full of questionsPAPARAZZO, Ernesto.Surface and interface analysis. 2008, Vol 40, Num 3-4, pp 450-453, issn 0142-2421, 4 p.Conference Paper
Grain boundary versus transgranular ductile failurePARDOEN, T; DUMONT, D; DESCHAMPS, A et al.Journal of the mechanics and physics of solids. 2003, Vol 51, Num 4, pp 637-665, issn 0022-5096, 29 p.Article
Microcavity of organic semiconductorBEI ZHANG; LEI ZHUANG; YONG LIN et al.Solid state communications. 1996, Vol 97, Num 6, pp 445-449, issn 0038-1098Article
Void evolution and the large-scale structureDUBINSKI, J; DA COSTA, L. N; GOLDWIRTH, D. S et al.The Astrophysical journal. 1993, Vol 410, Num 2, pp 458-468, issn 0004-637X, 1Article
Vesicoureteral reflux: comparison between urosonography and radionuclide cystographyASCENTI, Giorgio; ZIMBARO, Giovanni; MAZZIOTTI, Silvio et al.Pediatric nephrology (Berlin, West). 2003, Vol 18, Num 8, pp 768-771, issn 0931-041X, 4 p.Article
Molecular dynamics simulations of dislocation interaction with voids in nickelSIMAR, Aude; LEE VOIGT, Hyon-Jee; WIRTH, Brian D et al.Computational materials science. 2011, Vol 50, Num 5, pp 1811-1817, issn 0927-0256, 7 p.Article
Intrinsic defect complexes in CdTe and ZnTeCARVALHO, A; OBERG, S; BRIDDON, P. R et al.Thin solid films. 2011, Vol 519, Num 21, pp 7468-7471, issn 0040-6090, 4 p.Conference Paper
A unified approach to predict overall properties of composite materialsLI, L. X; WANG, T. J.Materials characterization. 2005, Vol 54, Num 1, pp 49-62, issn 1044-5803, 14 p.Article
Voids in hydrogenated amorphous silicon materialsBEYER, W; HILGERS, W; PRUNICI, P et al.Journal of non-crystalline solids. 2012, Vol 358, Num 17, pp 2023-2026, issn 0022-3093, 4 p.Conference Paper
The application of floating dies for high speed growth of CsI single crystals by edge-defined film-fed growth (EFG)GUGUSCHEV, Christo; CALVERT, George; PODOWITZ, Stephen et al.Journal of crystal growth. 2014, Vol 404, pp 231-240, issn 0022-0248, 10 p.Article
Variables Controlling Stiffness and Strength of Lime-Stabilized SoilsCONSOLI, Nilo Cesar; DA SILVA LOPES, Luizmar; MARQUES PRIETTO, Pedro Domingos et al.Journal of geotechnical and geoenvironmental engineering. 2011, Vol 137, Num 6, pp 628-632, issn 1090-0241, 5 p.Article
The high-temperature oxidation behavior of hot-dipping Al-Si coating on low carbon steelWANG, Chaur-Jeng; CHEN, Shih-Ming.Surface & coatings technology. 2006, Vol 200, Num 22-23, pp 6601-6605, issn 0257-8972, 5 p.Conference Paper