HOW TO WAVE SOLDER DISCRETE CHIP COMPONENTSWOODGATE R.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 21-22Article

SOLDER MASKING SOLDER-PLATED CIRCUITS.WHEELER J.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 6; PP. 107-110Article

TROUBLESHOOTING THE WAVESOLDERING SYSTEM: PROBLEMS WITH WAVESOLDERING EQUIPMENT RESULT FROM IMPROPER OPERATIONTURNER RL.1978; CIRCUITS MANUF.; USA; DA. 1978; VOL. 18; NO 11; PP. 24-28; (3 P.)Article

COMMON CAUSES OF WAVESOLDERING DEFECTSBERNARD CD.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 4; PP. 175-180; (4 P.)Article

FACTORS AFFECTING THE COST OF SOLDERINGLANGAN JP.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 1; PP. 207-214; (5 P.); BIBL. 7 REF.Article

GUIDE TO WAVE SOLDERING EQUIPMENT.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 2; PP. 38-46Article

SOLDERING OF LEADLESS COMPONENTSRAHN A; WOODGATE RW.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 1; PP. 13-14; BIBL. 6 REF.Article

IMMERSION WAVE SOLDERING PROCESSGETTEN JR; SENGER RC.1982; IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 3; PP. 379-382; BIBL. 8 REF.Article

WELLENLOETEN, EIN PRODUKTIONSVERFAHREN, DAS NICHT NUR AUF GEDRUCKTE SCHALTKREISE ANGEWANDT WIRD = WAVE SOLDERING, A PRODUCTION METHOD NOT LIMITED TO PRINTED CIRCUIT PROCESSING = APPLICATIONS DU BRASAGE A LA VAGUE AUTRES QUE LES CIRCUITS IMPRIMESRAHN A.1981; WEICHLOETEN UND SCHWEISSEN IN ELEKTRONIK UND FEINWERKTECHNIK. INTERNATIONALES KOLLOQUIUM/1981/MUENCHEN; DEU; DUESSELDORF: DVS; DA. 1981; PP. 36-38; ABS. ENG; BIBL. 2 REF.; LOC. ISConference Paper

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UNDERSTANDING THE SOLDER WAVE AND ITS EFFECTS ON SOLDER JOINTS.MANKO HH.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 1; PP. 45-49; BIBL. 13 REF.Article

HORIZONTAL VS. INCLINED CONVEYOR WAVESOLDERING WHICH APPROACH REDUCES SOLDER BRIDGES MORE EFFECTIVELY.BERNARD CD.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 9; PP. 53-55Article

WAVE SOLDERING JOINT QUALITY TROUBLE SHOOTING GUIDE.CASS B.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 13; PP. 23-25; BIBL. 5 REF.Article

WAVESOLDERING OF MOTOR ARMATURES INCREASES PRODUCTIVITY AND QUALITY1980; INSULAT. CIRCUITS; USA; DA. 1980; VOL. 26; NO 4; PP. 35-36Article

ELIMINATING SMOKE PROBLEMS DURING WAVE SOLDERING1979; INSUL. CIRCUITS; USA; DA. 1979; VOL. 25; NO 5; PP. 25-26Article

REPARATURLOETEN AN BESTUECKTEN LEITERPLATTEN = LA REPARATION PAR BRASAGE DES CIRCUITS IMPRIMES HYBRIDESMULLER H.1979; SCHWEISSTECHNIK; ISSN 0323-3073; DDR; DA. 1979; VOL. 29; NO 4; PP. 153-155; ABS. ENG/RUS; LOC. ISArticle

REMOVING SOLDER BRIDGES FROM PRINTED CIRCUIT BOARDSCOMERFORD MF.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 4; PP. 31-34; BIBL. 5 REF.Article

WATER SOLUBLE SOLDERING RAISES RELIABILITY RATE FOR TELEPHONE CIRCUIT PACKSBOULOS M; DUYCK TO.1979; INSULAT. CIRCUITS; USA; DA. 1979; VOL. 25; NO 4; PP. 39-42; BIBL. 4 REF.Article

LOETEN VON LEITERPLATTEN MIT WASSERLOESLICHEN HILFSSTOFFEN = LE BRASAGE DES CIRCUITS IMPRIMES AVEC DES FLUX SOLUBLES DANS L'EAUVOLKER HJ.1979; SCHWEISSTECHNIK; ISSN 0323-3073; DDR; DA. 1979; VOL. 29; NO 4; PP. 150-152; ABS. ENG/RUS; BIBL. 9 REF.; LOC. ISArticle

REDUCING THE LOW-LEVEL INCIDENCE OF SOLDER SHORTS IN WAVE SOLDERING.RUHL RL; METZ LD; HECKMAN R et al.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 2; PP. 82-85; BIBL. 8 REF.Article

CONTROL CONTAMINATION FOR HIGH EFFICIENCY WAVE SOLDERING.LANGAN JP.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 8; PP. 12Article

DIFFUSIONSVORGAENGE BEIM WEICHLOETPROZESS UNTER BESONDERER BERUECKSICHTIGUNG DES WELLENLOETVERFAHRENS = SHAPE AND FORMATION OF INTERMETALLIC ZONES DEPENDING ON SOLDER PARAMETERS WITH PARTICULAR REGARD TO WAVE SOLDERING = PHENOMENES DE DIFFUSION INTERVENANT LORS DU BRASAGE TENDRE ET NOTAMMENT DU BRASAGE A LA VAGUEFRIEDRICH D; KNOTT U; SCHMITT THOMAS KG et al.1981; WEICHLOETEN UND SCHWEISSEN IN ELEKTROMK UND FEINWERKTECHNIK. INTERNATIONALES KOLLOQUIUM/1981/MUENCHEN; DEU; DUESSELDORF: DVS; DA. 1981; PP. 11-15; ABS. ENG; BIBL. 1 REF.; LOC. ISConference Paper

MASS SOLDERING OF HIGH-DENSITY CIRCUIT PACKSGENGLER RH.1979; WEST. ELECTR. ENGR; USA; DA. 1979; VOL. 23; NO 4; PP. 38-42Article

WALVESOLDERING OF BACKPANELS WITH LONG WRAP POSTSELLIOTT DA; DOWN WH.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; NO 104; PP. 147-154; 5Article

AN ALTERNATIVE TO THERMAL PROFILING IN WASESOLDERING.BERNARD CD.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 2; PP. 34Article