Bewertung von Schädigungen an Lötverbindungen der oberflächenmontierten Bauelemente bei einem Temperaturschocktest = Evaluation des dommages subis par des brasures de composants montés en surface après des essais de chocs thermiques = Assessment of damages to soldered joints on surface mounted devices by a thermal shock testGABOR, H.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 180-183Conference Paper

Soudage et techniques connexes. Assemblages exécutés avec des produits d'apport de brasage tendre et de brasage fort. Méthodes d'essai mécanique = Welding and allied processes. Assemblies made with soft solders and brazing filler metals. Mechanical test methods1985, 12 p.Report

Reflow of AuSn Solder Creates Strong JointsGOLOSKER, Ilya; FLORANDO, Jeffrey.Welding journal. 2013, Vol 92, Num 2, pp 48-59, issn 0043-2296, 12 p.Article

2009 Pb-Free SoldersKANG, Sung K; ANDERSON, Iver; HANDWERKER, Carol et al.Journal of electronic materials. 2009, Vol 38, Num 12, issn 0361-5235, 362 p.Conference Proceedings

Schallemissionsanalyse an Weichlötstellen = Analyse par émission acoustique des assemblages brasés = Sound emission analysis applied to soldered jointsSCHMITT-THOMAS, K. G; WATERSCHEK, R.Schweissen + Schneiden. 1984, Vol 36, Num 8, pp 359-364, issn 0036-7184Article

A theory of fatigue: A physical approach with application to lead-rich solderWEN, S; KEER, L. M.Journal of applied mechanics. 2002, Vol 69, Num 1, pp 1-10, issn 0021-8936Article

Coupling effect in Pt/Sn/Cu sandwich solder joint structuresWANG, S. J; LIU, C. Y.Acta materialia. 2007, Vol 55, Num 10, pp 3327-3335, issn 1359-6454, 9 p.Article

Asymmetrical solder microstructure in Ni/Sn/Cu solder jointWANG, S. J; LIU, C. Y.Scripta materialia. 2006, Vol 55, Num 4, pp 347-350, issn 1359-6462, 4 p.Article

Application of push-off shear test for evaluation of wetting-interface structure-bonding relationship of solder jointsSOBCZAK, N; SOBCZAK, J; NOWAK, R et al.Journal of materials science. 2005, Vol 40, Num 9-10, pp 2547-2551, issn 0022-2461, 5 p.Article

Evaluating the duration of the solder wave brazing process = Evaluation de la durée de l'opération de brasageSTEPANSKII, L. G.Automatic Welding. 1986, Vol 39, Num 9, pp 60-61, issn 0005-108XArticle

Verhalten von Lötverbindungen unter thermischer und mechanischer Beanspruchung = Comportement de joints brasés sous contraintes thermiques et mécaniques = The behaviour of soldered joints under thermal and mechanical stressesSCHMITT-THOMAS, K. G; WEGE, S.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 133-136Conference Paper

Examination of the reaction kinetics at solder/metal interfaces via high temperature X-ray diffraction = Examen des cinétiques de réaction aux interfaces «produit apport brasage tendre/métal» par diffraction des RX à haute températureDEHAVEN, P. W; WALKER, G. A; O'NEIL, N. A et al.Advances in x-ray analysis. 1984, Vol 27, pp 389-395, issn 0376-0308Conference Paper

Electron probe research into brazed joints in the bodies of integral micro-circuits = Etude à l'aide d'une sonde électronique des assemblages brasés dans des boîtiers de microcitcuits intégrésBATALIN, G. I; BERZINA, A. I; PAPIZHENKO, V. V et al.Automatic Welding. 1982, Vol 35, Num 4, pp 31-33, issn 0005-108XArticle

Interfacial Reactions in Sn-Ag/Co CouplesCHEN, Sinn-Wen; CHEN, Tung-Kai; CHANG, Jui-Shen et al.Journal of electronic materials. 2014, Vol 43, Num 2, pp 636-639, issn 0361-5235, 4 p.Article

Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder jointsCHUANG, Tung-Han.Scripta materialia. 2006, Vol 55, Num 11, pp 983-986, issn 1359-6462, 4 p.Article

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder jointsHE, M; CHEN, Z; QI, G. J et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2005, Vol 36, Num 1, pp 65-75, issn 1073-5623, 11 p.Article

Effects of fourth alloying additives on interfacial microstructure of Sn-Ag-Cu lead-free soldered jointsKIM, K. S; SUGANUMA, K; SHIMOZAKI, T et al.Materials science forum. 2003, pp 7-11, issn 0255-5476, isbn 0-87849-923-7, 5 p.Conference Paper

The mechanical properties of soldered joints to surface mounted devices = Propriétés mécaniques de joints brasés sur des composants montés en surfaceHAWKINS, S. P; THWAITES, C. J; WARWICK, M. E et al.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 128-132Conference Paper

Cryogenic testing of reinforcing bars for the containment structure of LNG storage tanks = Essais à basse température de barres à béton pour l'enveloppe de sécurité de réservoirs de stockage de GNLLEFEVRE, A.Transport and storage of LPG and LNG. Conference. 1984, pp 321-333Conference Proceedings

Influence of the Substrate on the Creep of SN Solder JointsLEE, K.-O; MORRIS, J. W; HUA, F et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 7, pp 1805-1814, issn 1073-5623, 10 p.Article

Polarity effect of electromigration on intermetallic compound formation in SnPb solder jointsLU, Yu-Dong; HE, Xiao-Qi; EN, Yun-Fei et al.Acta materialia. 2009, Vol 57, Num 8, pp 2560-2566, issn 1359-6454, 7 p.Article

Ductile-to-brittle transition in Sn-Zn solder joints measured by impact testDATE, M; SHOJI, T; FUJIYOSHI, M et al.Scripta materialia. 2004, Vol 51, Num 7, pp 641-645, issn 1359-6462, 5 p.Article

Analysis of ring and plug shear strengths for comparison of lead-free soldersFOLEY, J. C; GICKLER, A; LEPREVOST, F. H et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1258-1263, issn 0361-5235Conference Paper

Thermographische Defektoskopie: erste Ergebnisse = Essai non destructif par thermographie: premiers résultats = Thermographic flaw detection: first resultsSTEINICKE, H.-E.ZIS-Mitteilungen. 1986, Vol 28, Num 8, pp 852-861, issn 0044-1465Article

Lötverbindungen der keramischen Chip Carrier auf konventionellen und alternativen Basismaterialien = Joints brasés de supports de puces sur des matériaux conventionnels ou nouveaux = Solder joints of ceramic chip carriers on conventional and new base materialsFLORJANCIC, M.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 136-137Conference Paper