Soudures sans étain pour brasage tendre = Tin-free soldersKUZIO, T; WINIOWSKI, A.1984, Num 1, pp 14-16, issn 0324-8860Article

On the non-occurrence of tin pest in tin-silver-indium soldersSEMENOVA, Olga; FLANDORFER, Hans; IPSER, Herbert et al.Scripta materialia. 2005, Vol 52, Num 2, pp 89-92, issn 1359-6462, 4 p.Article

Challenges in attaining lead-free soldersBASKIN, Philip.Welding journal. 2007, Vol 86, Num 3, pp 58-61, issn 0043-2296, 4 p.Article

Evaluating the wetting of materials by solders using scanning meniscography = Evaluation par méniscographie en continu du mouillage de matériaux par des métaux d'apport de brasage tendrePODLESNYKH, V. G; TKACHEV, M. A.Welding Production. 1984, Vol 31, Num 7, pp 49-52, issn 0043-230XArticle

Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal agingYANGHUA XIA; XIAOMING XIE; XIAOMING XIE et al.XIAOMING XIE; XIAOMING XIE et al.Journal of materials science. 2006, Vol 41, Num 8, pp 2359-2364, issn 0022-2461, 6 p.Article

Some properties of soldered joints made with a tin/silver eutectic alloy = Propriétés des joints brasés avec l'alliage eutectique étain/argentLONDON, J; ASHALL, D. W.1986, Num 10, pp 17-23, issn 0263-0060Article

The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloysSPINELLI, José Eduardo; SILVA, Bismarck Luiz; CHEUNG, Noé et al.Materials characterization. 2014, Vol 96, pp 115-125, issn 1044-5803, 11 p.Article

Metallographische Probenpräparation von verlöteten Solarzellen = Metallographic Sample Preparation of Soldered Solar CellsEBERLEIN, Dirk; SCHMITT, Peter; VOOS, Patrick et al.Praktische Metallographie. 2011, Vol 48, Num 5, pp 239-260, issn 0032-678X, 22 p.Article

In-situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloyYING DING; CHUNQING WANG; YANHONG TIAN et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2006, Vol 37, Num 3A, pp 1017-1025, issn 1073-5623, 9 p.Article

Solder alloys : A look at the past, present and futureVIANCO, P. T.Welding journal. 1997, Vol 76, Num 3, pp 45-49, issn 0043-2296Article

Untersuchung der Mischbarkeit des Kupfers in Zinn-Blei- oder Blei-Zinn-Lotlegierungen = Etude de la miscibilité du cuivre dans des métaux d'apport de brasage Sn-Pb ou Pb-Sn = Investigation into the miscibility of copper in tin-lead and lead-tin alloysSZYMANSKI, J.Schweissen + Schneiden. 1986, Vol 38, Num 7, pp 320-323, issn 0036-7184Article

Atom movements of gold in lead-tin solders = Mouvements d'atomes d'or dans des métaux d'apport de brasage plomb-étainCHAO-KUN HU; HUNTINGTON, H. B.Journal of applied physics. 1985, Vol 58, Num 7, pp 2564-2569, issn 0021-8979Article

Entwicklung und Stand der Löttechnik in Österreich. II = Niveau actuel et développement du brasage en Autriche. II = Present status and development of brazing and soldering in Austria. IISIXT, B.Schweisstechnik (Wien). 1984, Vol 38, Num 1, pp 15-16, issn 0253-5262Article

Shear strength of solder alloys = Résistance au cisaillement des métaux d'apport de brasage tendreREICHENECKER, W. J.Materials engineering. 1983, Vol 98, Num 1, pp 12-13, issn 0025-5319Article

Size distribution and morphology of Cu₆Sn₅ scallops in wetting reaction between molten solder and copperSUH, J. O; TU, K. N; LUTSENKO, G. V et al.Acta materialia. 2008, Vol 56, Num 5, pp 1075-1083, issn 1359-6454, 9 p.Article

Measurement of deformations in SnAgCu solder interconnects under in situ thermal loadingPARK, Seungbae; DHAKAL, Ramji; LEHMAN, Lawrence et al.Acta materialia. 2007, Vol 55, Num 9, pp 3253-3260, issn 1359-6454, 8 p.Article

Gefügeentwicklung durch Wärmebehandlung an Maonesiumlötverbindungen = Microstructure development by thermal treatment on soldered magnesium jointsWIELAGE, Bernhard; MÜCKLICH, Silke.Praktische Metallographie. 2007, Vol 44, Num 7, pp 307-316, issn 0032-678X, 10 p.Article

Transmission electron microscopy of diffusion-soldered Ni/Al/Ni interconnectionsJEZIERSKA, E; LOPEZ, G. A; ZIEBA, P et al.Materials chemistry and physics. 2003, Vol 81, Num 2-3, pp 569-572, issn 0254-0584, 4 p.Conference Paper

Dampfphasen-Loeten eine vielseitige Technik = Vapour-phase soldering - a versatile techniqueKARPEL, S.1986, Vol 150, pp 14-17, issn 0173-6019Article

Using differential scanning calorimetry to determine the percent tin in high-lead solders = Utilisation de la calorimétrie à balayage différentiel pour déterminer la teneur en étain de métaux d'apport de brasage tendre à forte teneur en plombAMEEN, J. G; VEERARAGHAVAN, V. G.1986, Num 10, pp 43-47, issn 0263-0060Article

Décision du 20 décembre 1985 relative à l'agrément de matériaux d'assemblage = Decree of 20 December 1985 concerning the homologation of filler metals1985, Num 9, pp 37-38Article

Le fer et la soudure dans une seule main = A compact soldering ironCOLOMBIER, A.Industries et techniques (1960). 1984, Num 529, issn 0150-6617, 71Article

Reflow of AuSn Solder Creates Strong JointsGOLOSKER, Ilya; FLORANDO, Jeffrey.Welding journal. 2013, Vol 92, Num 2, pp 48-59, issn 0043-2296, 12 p.Article

Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomographyLING JIANG; CHAWLA, Nikhilesh; PACHECO, Mario et al.Materials characterization. 2011, Vol 62, Num 10, pp 970-975, issn 1044-5803, 6 p.Article

Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi pasteSHIH, Po-Cheng; LIN, Kwang-Lung.Journal of materials science. 2007, Vol 42, Num 8, pp 2574-2581, issn 0022-2461, 8 p.Article