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New technology for the design of advanced ultrasonic transducers for high-power applicationsPARRINI, Lorenzo.Ultrasonics. 2003, Vol 41, Num 4, pp 261-269, issn 0041-624X, 9 p.Article

Placement of piezoelectric ceramic sensors in ultrasonic wire-bonding transducersCHU, Paul Wing-Po; CHONG, Chi-Po; CHAN, Helen Lai-Wa et al.Microelectronic engineering. 2003, Vol 66, Num 1-4, pp 750-759, issn 0167-9317, 10 p.Conference Paper

Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics PackagingJUNHUI LI; XIAOLONG ZHANG; LINGGANG LIU et al.Journal of microelectromechanical systems. 2013, Vol 22, Num 3, pp 560-568, issn 1057-7157, 9 p.Article

A new bonding-tool solution to improve stitch bondabilityGOH, K. S; ZHONG, Z. W.Microelectronic engineering. 2007, Vol 84, Num 1, pp 173-179, issn 0167-9317, 7 p.Article

Manufacturability and reliability of fine pitch wirebondingAOKI, Toyohiro; SAUTER, Wolfgang; HISADA, Takashi et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 372-376Conference Paper

Wire-to-wire bonding of mμ-diameter aluminum wires for the Electric Solar Wind SailSEPPÄNEN, Henri; KIPRICH, Sergiy; KURPPA, Risto et al.Microelectronic engineering. 2011, Vol 88, Num 11, pp 3267-3269, issn 0167-9317, 3 p.Article

Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energyXU, H; ACOFF, V. L; LIU, C et al.Microelectronic engineering. 2011, Vol 88, Num 10, pp 3155-3157, issn 0167-9317, 3 p.Article

Real time contact resistance measurement to determine when microwelds start to form during ultrasonic wire bondingSEPPÄNEN, Henri; KURPPA, Risto; MERILÄINEN, Antti et al.Microelectronic engineering. 2013, Vol 104, pp 114-119, issn 0167-9317, 6 p.Article

In situ ultrasonic force signais during low-temperature thermosonic copper wire bondingSHAH, A; MAYER, M; ZHOU, Y et al.Microelectronic engineering. 2008, Vol 85, Num 9, pp 1851-1857, issn 0167-9317, 7 p.Article

Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bondingGOH, K. S; ZHONG, Z. W.Microelectronic engineering. 2007, Vol 84, Num 2, pp 362-367, issn 0167-9317, 6 p.Article

An impact force compensation algorithm based on a piezo force sensor for wire bonding processesKIM, Jung-Han; YIM, Chung-Hyuk.Control engineering practice. 2008, Vol 16, Num 6, pp 685-696, issn 0967-0661, 12 p.Article

COPPER WIRE BONDINGMAYER, Michael; LAI, YI-Shao.Microelectronics and reliability. 2011, Vol 51, Num 1, issn 0026-2714, 189 p.Serial Issue

Return loss reduction of molded bonding wires by comb capacitorsCHYAN, J.-Y; YEH, J. Andrew.IEEE transactions on advanced packaging. 2006, Vol 29, Num 1, pp 98-101, issn 1521-3323, 4 p.Article

Gold wire bonding on low-K material a new challenge for interconnection technologyBINNER, Ralph; SCHOPPER, Andreas; CASTANEDA, Jimmy et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 13-17, isbn 0-7803-8582-9, 1Vol, 5 p.Conference Paper

Low-Stress Thermosonic Copper Ball BondingSHAH, Aashish; MAYER, Michael; NORMAN ZHOU, Y et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 3, pp 176-184, issn 1521-334X, 9 p.Article

Study of factors affecting the hardness of ball bonds in copper wire bondingZHONG, Z. W; HO, H. M; TAN, Y. C et al.Microelectronic engineering. 2007, Vol 84, Num 2, pp 368-374, issn 0167-9317, 7 p.Article

Dynamics Features of Cu-Wire Bonding During Overhang Bonding ProcessLI JUNHUI; LIU LINGGANG; MA BANGKE et al.IEEE electron device letters. 2011, Vol 32, Num 12, pp 1731-1733, issn 0741-3106, 3 p.Article

Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding ProcessLEE, J; MAYER, M; ZHOU, Y et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 3, pp 157-163, issn 1521-334X, 7 p.Article

Acid decapsulation of epoxy molded IC packages with copper wire bondsMURALI, Sarangapani; SRIKANTH, Narasimalu.IEEE transactions on electronics packaging manufacturing. 2006, Vol 29, Num 3, pp 179-183, issn 1521-334X, 5 p.Article

Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking forceHANG, C. J; SONG, W. H; LUM, I et al.Microelectronic engineering. 2009, Vol 86, Num 10, pp 2094-2103, issn 0167-9317, 10 p.Article

Investigation of ultrasonic vibrations of wire-bonding capillariesZHONG, Z. W; GOH, K. S.Microelectronics journal. 2006, Vol 37, Num 2, pp 107-113, issn 0959-8324, 7 p.Article

Design concept for wire-bonding reliability improvement by optimizing position in power devicesISHIKO, Masayasu; USUI, Masanori; OHUCHI, Takashi et al.Microelectronics journal. 2006, Vol 37, Num 3, pp 262-268, issn 0959-8324, 7 p.Conference Paper

Bonding wire characterization using automatic deformability measurementHANG, C. J; LUM, I; LEE, J et al.Microelectronic engineering. 2008, Vol 85, Num 8, pp 1795-1803, issn 0167-9317, 9 p.Article

Effect of indenter shapes on bond pad hardness studies of low-k devicesSRIKANTH, Narasimalu; LIM CHEE TIONG; VATH, Charles J et al.Microelectronic engineering. 2008, Vol 85, Num 2, pp 440-443, issn 0167-9317, 4 p.Article

Mikrostrukturen : Prozesswissen erlaubt höchste präzision = MicrostructuresGEMMLER, A; KELLER, W; RICHTER, H et al.Metalloberfläche. 1993, Vol 47, Num 9, pp 461-468, issn 0026-0797Article

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