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Copper electrodeposition of high-aspect-ratio vias for three dimensional packagingKONDO, Kazuo; YONEZAWA, Toshihiro; TOMISAKA, Manabu et al.Proceedings - Electrochemical Society. 2003, pp 28-32, issn 0161-6374, isbn 1-56677-390-3, 5 p.Conference Paper

Process integration of 3D chip stack with vertical interconnectionTAKAHASHI, Kenji; TAGUCHI, Yuichi; UMEMOTO, Mitsuo et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 601-609Conference Paper

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