Pascal and Francis Bibliographic Databases


Search results

Your search

au.\*:("YOSHIDA, Fusahito")

Publication Year[py]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Discipline (document) [di]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Author Country

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Results 1 to 12 of 12

  • Page / 1


Selection :

  • and

Deformation characteristics and delamination strength of adhesively bonded aluminium alloy sheet under plastic bendingTAKIGUCHI, Michihiro; YOSHIDA, Fusahito.JSME international journal. Series A, Solid mechanics and material engineering. 2003, Vol 46, Num 1, pp 68-75, issn 1344-7912, 8 p.Article

Interaction relation in 60Sn-Pb-0.05La ternary solder alloyMA, Xin; YOSHIDA, Fusahito.Materials letters (General ed.). 2002, Vol 56, Num 4, pp 441-445, issn 0167-577X, 5 p.Article

A plasticity model describing yield-point phenomena of steels and its application to FE simulation of temper rollingYOSHIDA, Fusahito; KANEDA, Yuya; YAMAMOTO, Shigeo et al.International journal of plasticity. 2008, Vol 24, Num 10, pp 1792-1818, issn 0749-6419, 27 p.Article

A shape determination method for forged products in consideration of shape complexitySAKAMOTO, Yasuhiro; YOSHIDA, Fusahito; MATSUNAGA, Hisanori et al.JSME international journal. Series A, Solid mechanics and material engineering. 2003, Vol 46, Num 4, pp 536-542, issn 1344-7912, 7 p.Article

Strengthening Sn60-Pb40 solder alloy by adding trace amount of LaXIN MA; YIYU QIAN; YOSHIDA, Fusahito et al.Materials letters (General ed.). 2002, Vol 52, Num 4-5, pp 319-322, issn 0167-577XArticle

Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interfaceXIN MA; FENGJIANG WANG; YIYU QIAN et al.Materials letters (General ed.). 2003, Vol 57, Num 22-23, pp 3361-3365, issn 0167-577X, 5 p.Article

Experimental and Calculated Cyclic Elasto-Plastic Deformations of Copper-Based Spring Materials : Recent Development of Electro-Mechanical Devices - Papers selected from International Session on Electro-Mechanical Devices 2012 (IS-EMD2012) and other recent research resultsHATTORI, Yasuhiro; FURUKAWA, Kingo; YOSHIDA, Fusahito et al.IEICE transactions on electronics. 2013, Vol 96, Num 9, pp 1157-1164, issn 0916-8524, 8 p.Article

On the loading curve in microindentation of viscoplastic solder alloyXIN MA; YOSHIDA, Fusahito; SHINBATA, Kazuhiro et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2003, Vol 344, Num 1-2, pp 296-299, issn 0921-5093, 4 p.Article

Elasto-plasticity Behavior of IF Steel Sheet with Planar Anisotropy and Its Macro-meso ModelingKITAYAMA, Kohshiroh; KOBAYASHI, Takumi; UEMORI, Takeshi et al.ISIJ international. 2012, Vol 52, Num 4, pp 735-742, issn 0915-1559, 8 p.Article

Experimental observation of elasto-plasticity behavior of type 5000 and 6000 aluminum alloy sheetsTAMURA, Shohei; SUMIKAWA, Satoshi; UEMORI, Takeshi et al.Keikinzoku. 2011, Vol 61, Num 6, pp 255-261, issn 0451-5994, 7 p.Article

Fracture mechanism and forming limit in deep-drawing of magnesium alloy AZ31KOHZU, Masahide; YOSHIDA, Fusahito; SOMEKAWA, Hidetoshi et al.Materials transactions - JIM. 2001, Vol 42, Num 7, pp 1273-1276, issn 0916-1821Conference Paper

Anomalous surface deformation of sapphire clarified by 3D-FEM simulation of the nanoindentationNOWAK, Roman; MANNINEN, Timo; LI, Chunliang et al.JSME international journal. Series A, Solid mechanics and material engineering. 2003, Vol 46, Num 3, pp 265-271, issn 1344-7912, 7 p.Conference Paper

  • Page / 1