Cuivre-Nickel-Étain: une nouvelle génération d'alliages de cuivre à haute performanceTARDENT, Jean-Pierre.Traitements & matériaux. 2010, Vol 401, pp 46-48, issn 2108-2804, 3 p.Article

Thermodynamic properties of liquid Bi-Sn alloysASRYAN, Nadezhda; MIKULA, Adolf.Zeitschrift für Metallkunde. 2004, Vol 95, Num 3, pp 132-135, issn 0044-3093, 4 p.Article

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The use of tin-lead alloy models to determine static strengthFESSLER, H; HYDE, T. H.ÖIAZ. 1996, Vol 141, Num 4, pp 176-178, issn 0721-9415Article

Corrosion resistance of nickel-plated casings of microcircuits sealed by soldering in sea climate conditions = Résistance à la corrosion dans un climat marin de boîtiers de microcircuits revêtus de nickel et brasés pour assurer l'étanchéitéBERZINA, A. I; ALEKHIN, V. P.Welding Production. 1984, Vol 31, Num 3, pp 37-38, issn 0043-230XArticle

Effect of design and technological factors on the reduction in diameter of metallised openings in printed circuits in melting the tin-lead coatings = Influence de la conception et des facteurs technologiques sur la réduction du diamètre des trous métallisés de circuits imprimés lors de la fusion du revêtement étain-plombKUDRYAVTSEV, V. S; NIKOFOROV, G. D; DOLGOV, YU. S et al.Welding Production. 1982, Vol 29, Num 11, pp 13-14, issn 0043-230XArticle

Heterogeneous nucleation behavior in undercooled Sn-Bi alloysDE CASTRO, W. B; KIMINAMI, C. S.Journal of materials science letters. 1999, Vol 18, Num 6, pp 487-488, issn 0261-8028Article

Electrodeposition of CuSn alloy from sulfosuccinate bathNAKAMURA, Toshihiro; MIZUTANI, Yasushi; NAGAYAMA, Tomio et al.Hyomen gijutsu. 2004, Vol 55, Num 7, pp 484-488, issn 0915-1869, 5 p.Article

The recycling of tin = Le recyclage de l'étainHALSALL, P.Conservation & recycling. 1987, Vol 10, Num 2-3, pp 83-91, issn 0361-3658Conference Paper

Corrosion of soldered and brazed joints in tap water = Corrosion des joints obtenus par brasage tendre et brasage fort au contact de l'eau courantsNIELSEN, K.1983, Num 5, pp 32-36, issn 0263-0060Article

Concentration fluctuations and surface tension in liquid Au-Sn-ZnTERZIEFF, P.Journal of materials science. 2005, Vol 40, Num 14, pp 3759-3763, issn 0022-2461, 5 p.Article

A bismuth-tin alloy for hermetic seals = Alliage bismuth-étain pour des joints étanchesDOGRA, K. S.1985, Num 9, pp 28-30, issn 0263-0060Article

Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressingSHA XU; YAN CHEONG CHAN; KAILI ZHANG et al.Journal of alloys and compounds. 2014, Vol 595, pp 92-102, issn 0925-8388, 11 p.Article

A simple process for electrodeposition of Sn-rich, Au-Sn solder filmsWATT, Charles; QI LIU; IVEY, Douglas G et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 2, pp 827-837, issn 0957-4522, 11 p.Article

Formation of Sn―Bi solder alloys by sequential electrodeposition and reflowGOH, Yingxin; SEEN FANG LEE; ABDUL HASEEB, A. S. Md et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 6, pp 2052-2057, issn 0957-4522, 6 p.Article

Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly ApplicationsMALLIK, Sabuj; LAAM CHAN, Erica Hiu; EKERE, Ndy et al.Journal of materials engineering and performance. 2013, Vol 22, Num 4, pp 1186-1193, issn 1059-9495, 8 p.Article

Review on microstructure evolution in Sn―Ag―Cu solders and its effect on mechanical integrity of solder jointsSONA, Mrunali; PRABHU, K. N.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 9, pp 3149-3169, issn 0957-4522, 21 p.Article

Evaluation of the inhibitive effect of benzotriazole on archeological bronze in acidic mediumHASSAIRI, Hèla; BOUSSELMI, Latifa; KHOSROF, Slim et al.Applied physics. A, Materials science & processing (Print). 2013, Vol 113, Num 4, pp 923-931, issn 0947-8396, 9 p.Article

Creep behaviour of Mg-8% Sn and Mg-8% Sn-3% Al-1% Si alloysPODDAR, P; SAHOO, K. L; MUKHERJEE, S et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2012, Vol 545, pp 103-110, issn 0921-5093, 8 p.Article

Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface FinishCHU, Ming-Hui; LIANG, S. W; CHIH CHEN et al.Journal of electronic materials. 2012, Vol 41, Num 9, pp 2502-2507, issn 0361-5235, 6 p.Article

Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free SolderVAN SON, Phung; FUJITSUKA, Akira; OHSHIMA, Ken-Ichi et al.Journal of electronic materials. 2012, Vol 41, Num 7, pp 1893-1897, issn 0361-5235, 5 p.Article

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Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu JointsZHOU, M. B; MA, X; ZHANG, X. P et al.Journal of electronic materials. 2012, Vol 41, Num 11, pp 3169-3178, issn 0361-5235, 10 p.Article

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical FatigueLIANG YIN; LUKE WENTLENT; LINLIN YANG et al.Journal of electronic materials. 2012, Vol 41, Num 2, pp 241-252, issn 0361-5235, 12 p.Article

Abnormal accumulation of intermetallic compound at cathode in a SnAg₃.₀Cu_0.5 lap joint during electromigrationMINGYU LI; HONG CHANG; XIAOCHAO PANG et al.Journal of physics. D, Applied physics (Print). 2011, Vol 44, Num 11, issn 0022-3727, 115501.1-115501.8Article