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MAKING LSI CIRCUITS: A COMPARISON OF PROCESSING TECHNIQUESSCHMID H.1972; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1972; VOL. 1; NO 2; PP. 19-31; BIBL. 1 P.Serial Issue

INTEGRATED SOLID-STATE DEVICES.WHEATLEY CF JR.1974; S.A.E. TRANS.; U.S.A.; DA. 1974; VOL. 83; NO 1; PP. 58-86; BIBL. 17 REF.Article

INTEGRIERTE SCHALTUNGEN. EINE EINFUEHRUNGHAURI ER.1973; P.T.T. BULL. TECH.; SUISSE; DA. 1973; VOL. 51; NO 2; PP. 44-52; ABS. ITAL.; BIBL. 20 REF.; MEME ART. FRSerial Issue

DUENNSCHICHTSYSTEM FUER HYBRIDSCHALTKREISE - HERGESTELLT DURCH PLASMATRONZERSTAEUBEN = ENSEMBLE DE FILMS MINCES SUPERPOSES POUR CIRCUITS HYBRIDES FABRIQUE PAR PULVERISATION PAR PLASMATRONSCHILLER S; HEISIG U; GOEDICKE K et al.1982; NACHRICHTENTECH., ELEKTRON.; ISSN 0323-4657; DDR; DA. 1982; VOL. 32; NO 3; PP. 105-108; BIBL. 11 REF.Article

International Conference on Design & Test of Integrated Systems in Nanoscale TechnologyMASMOUDI, Mohamed; RENOVELL, Michel; GIRARD, Patrick et al.International journal of electronics. 2008, Vol 95, Num 3, issn 0020-7217, 128 p.Conference Proceedings

TECHNOLOGIES MODERNES POUR APPAREILS DE TELECOMMUNICATION.TIESNES M.1977; REV. BROWN BOVERI; SUISSE; DA. 1977; VOL. 64; NO 8; PP. 474-477Article

INTEGRATED SOLID-STATE DEVICES.WHEATLEY CF JR.1974; IN: AUTOMOT. ELECTRON. SOC. AUTOMOT. ENG. INST. ELECTR. ELECTRON. ENG. CONF. TUTORIAL SESS.; DETROIT, MICH.; 1974; NEW YORK; SOC. AUTOMOT. ENG.; DA. 1974; PP. 38-66; BIBL. 26 REF.Conference Paper

APPLICATIONS OF MICRO-ELECTRONICSHAJELA SK.1980; J. INSTIT. ELECTRON. TELECOMMUNIC. ENGRS; IND; DA. 1980; VOL. 26; NO 2; PP. 152-160Article

A THICK AND THIN FILM APPROACH TO FABRICATING MCA SUBSTRATES.CALEY RW.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 12; PP. 135-149 (12P.); BIBL. 18 REF.Article

LECS TO CONFOUND PESSIMISTS.1975; ELECTRON. COMPON.; G.B.; DA. 1975; VOL. 17; NO 8; PP. 13-23 (6P.)Article

HYBRID INTEGRATED CIRCUIT MANUFACTURING PROCESS AS CONTROLLED BY SHOP INFORMATION SYSTEMSKRAUSE DL; LOCY DA.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 345-353; BIBL. 4 REF.Article

INGENIEURTECHNISCHE UND TECHNOLOGISCHE PROBLEME DER HYBRID-INTEGRATION = LES PROBLEMES DE L'INGENIEUR ET LES PROBLEMES TECHNOLOGIQUES DE L'INTEGRATION HYBRIDEKIENAST W.1979; NACHR.-TECH. ELEKTRON.; DDR; DA. 1979; VOL. 29; NO 4; PP. 147-150; BIBL. 15 REF.Article

RESISTOR LOOPS IN HYBRID CIRCUITS.SWART PL; VAN WYK JD.1976; MICROELECTRONICS; G.B.; DA. 1976; VOL. 7; NO 3; PP. 53-55Article

SUR LA QUESTION DE LA MICROMINIATURISATION COMPLEXE DES DISPOSITIFS HFIRLIN AV; KEMPA YA M.1976; POLUPROVODN. TEKH. MIKROELEKTRON., U.S.S.R.; S.S.S.R.; DA. 1976; NO 24; PP. 4-20; BIBL. 19 REF.Article

BAUSTEINE UND SCHALTUNGSKREISE HYBRIDER FORMEN. = COMPOSANTS ET CIRCUITS DE FORME HYBRIDEDUENBOSTEL W.1975; OESTERR. Z. ELEKTR.-WIRTSCH.; OESTERR.; DA. 1975; VOL. 28; NO 7; PP. 375-393; ABS. ANGL. FR.; BIBL. 19 REF.Article

LINEAR MICROCIRCUITS. A TESTING CHALLENGE.CROMER EG.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 10; PP. 44-51 (6P.); BIBL. 8 REF.Article

Proceedings of the 11th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA 2004)Chung, Steve S.International Symposium on the Physical & Failure Analysis of Integrated Circuits. 2004, isbn 0-7803-8454-7, 1Vol, 326 p., isbn 0-7803-8454-7Conference Proceedings

ECONOMICS AND THE MARKETEFFENBERGER E.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 6; NO 3-4; PP. 205-207; BIBL. 3 REF.Article

DESIGN OF AN ACTIVE FILTER FOR CHANNEL TRANSLATING EQUIPMENT.REWAL MK.1975; I. INSTIT. ELECTRON. TELECOMMUNIC. ENGRS; INDIA; DA. 1975; VOL. 21; NO 8; PP. 409-412; BIBL. 8 REF.Article

THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article

THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article

HIGH RELIABILITY TA/A1 THIN-FILM HYBRID CIRCUITS.DUCKWORTH RG.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 2; PP. 141-146; BIBL. 4 REF.Article

MODE-SELECTIVE PROPERTIES OF A METAL-CLAD-DIELECTRIC-SLAB WAVEGUIDE FOR INTEGRATED OPTICSBATCHMAN TE; RASHLEIGH SC.1972; I.E.E.E. J. QUANTUM ELECTRON.; U.S.A.; DA. 1972; VOL. 8; NO 11; PP. 848-850; BIBL. 4 REF.Serial Issue

A VLSI model of the bat lateral superior olive for azimuthal echolocationSHI, R. Z; HORIUCHI, T. K.IEEE International Symposium on Circuits and Systems. 2004, pp 900-903, isbn 0-7803-8251-X, 4 p.Conference Paper

2007 Radio Frequency Integrated Circuits (RFIC) SymposiumRUDELL, Jacques C.IEEE journal of solid-state circuits. 2008, Vol 43, Num 5, pp 1054-1194, issn 0018-9200, 140 p.Conference Paper

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