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Results 1 to 25 of 50591

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Microfluidic integrated circuits for signal processing using analogous relationship between pneumatic microvalve and MOSFETTAKAO, Hidekuni; ISHIDA, Makoto.Journal of microelectromechanical systems. 2003, Vol 12, Num 4, pp 497-505, issn 1057-7157, 9 p.Article

SPECIAL ISSUE ON THE 36th EUROPEAN SOLID-STATE CIRCUITS CONFERENCE (ESSCIRC)RODRIGUEZ-VASQUEZ, Angel; LEENAERTS, Dominie M. W; PINEDA DE GYVEZ, José et al.IEEE journal of solid-state circuits. 2011, Vol 46, Num 7, issn 0018-9200, 249 p.Serial Issue

2011 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCESAVOJ, Jafar; MANOLI, Yiannos; DARABI, Hooman et al.IEEE journal of solid-state circuits. 2011, Vol 46, Num 12, issn 0018-9200, 437 p.Conference Proceedings

Méthodologie de conception des circuits monolithiques hyperfréquences sur Arséniure de Gallium = Design methodology of AsGa microwave monolithic integrated circuitsDUEME, P; APERCE, G.Onde électrique. 1989, Vol 69, Num 2, pp 22-28, issn 0030-2430, 7 p.Article

Electroplating important in manufacturing cofired multilayer ceramic modules and packagesSISOLAK, R.Electri.onics. 1983, Vol 29, Num 10, pp 25-26, issn 0745-4309Article

Special Issue on the 2011 IEEE International Solid-State Circuits ConferenceIEEE journal of solid-state circuits. 2012, Vol 47, Num 1, issn 0018-9200, 354 p.Conference Proceedings

SPECIAL ISSUE ON THE 37TH EUROPEAN SOLID-STATE CIRCUITS CONFERENCE (ESSCIRC)ALVANDPOUR, Atila; REYNAERT, Patrick; YTTERDAL, Trond et al.IEEE journal of solid-state circuits. 2012, Vol 47, Num 7, issn 0018-9200, 288 p.Conference Proceedings

Ka-Band front end with monolithic, hybrid, and lumped-element IC'sMEIER, P. J; CALVIELLO, J. A; CAPPELLO, A. J et al.IEEE transactions on microwave theory and techniques. 1986, Vol 34, Num 4, pp 412-419, issn 0018-9480Article

New power-of-2 RNS scaling scheme for cell-based IC designMEYER-BÄSE, Uwe; STOURAITIS, Thanos.IEEE transactions on very large scale integration (VLSI) systems. 2003, Vol 11, Num 2, pp 280-283, issn 1063-8210, 4 p.Article

Silicon hybrid wafer-scale package technologyJOHNSON, R. W; DAVIDSON, J. L; JAEGER, R. C et al.IEEE journal of solid-state circuits. 1986, Vol 21, Num 5, pp 845-851, issn 0018-9200Article

Semiconductor photonic integrated circuitsKOCH, T. L; KOREN, U.IEEE journal of quantum electronics. 1991, Vol 27, Num 3, pp 641-653, issn 0018-9197Article


Proceedings of the 11th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA 2004)Chung, Steve S.International Symposium on the Physical & Failure Analysis of Integrated Circuits. 2004, isbn 0-7803-8454-7, 1Vol, 326 p., isbn 0-7803-8454-7Conference Proceedings

Monolithic integrated mm-wave circuits on high resistivity siliconSCHÖLLHORN, Claus; KASPER, Erich.Recent research developments in microwave theory & techniques Vol. 2 - 2004. Recent research developments in microwave theory & techniques. 2004, pp 155-182, isbn 81-7895-150-9, 28 p.Book Chapter

International Conference on Design & Test of Integrated Systems in Nanoscale TechnologyMASMOUDI, Mohamed; RENOVELL, Michel; GIRARD, Patrick et al.International journal of electronics. 2008, Vol 95, Num 3, issn 0020-7217, 128 p.Conference Proceedings

How to select adhesives for hybrid circuit assemblyLEFEVER, D. W.Electri.onics. 1985, Vol 31, Num 3, pp 23-26, issn 0745-4309Article

Optimum computer aided design for hybrid ICsKOHARA, H; USHIGOME, M; KAWASHIMA, S et al.NEC research & development. 1988, Num 91, pp 104-110, issn 0547-051XArticle

Nitrogen-filled storage cabinets avoid oxidation of hybrid componentsVOGEL, J.Electri.onics. 1983, Vol 29, Num 9, pp 29-30, issn 0745-4309Article

46.5-GHz-bandwidth monolithic receiver OEIC consisting of a waveguide pin photodiode and a distributed amplifierMURAMOTO, Y; TAKAHATA, K; FUKANO, H et al.IEE conference publication. 1997, pp 37-40, issn 0537-9989, isbn 0-85296-697-0, 5VolConference Paper

Modelling of shunt connected single radial stub for CAD applicationsGIANNINI, F; PAOLONI, C.Alta frequenza. 1988, Vol 57, Num 5, pp 227-232, issn 0002-6557Article

Variations in processing substrate with ccc'sBOCCIA, L. J.Electri.onics. 1984, Vol 30, Num 5, pp 20-24, issn 0745-4309Article

Automating thick film processes improves hybrid circuitsCUNDY, A. S.Electri.onics. 1983, Vol 29, Num 11, pp 27-30, issn 0745-4309Article

Manufacturing mainframes: component fabrication and component procurement at IBM and Sperry Univac, 1960-1975 : High Tech Manufacture = La fabrication des unités centrales : la production de composants et l'approvisionnement chez IBM et le Sperry Univac, 1960-1975 : L'industrie de haute technologieYOST, Jeffrey R.History and technology. 2009, Vol 25, Num 3, pp 219-235, issn 0734-1512, 17 p.Article

A new type hybrid IC in a transfer-molded standard packageNITTA, H; SASAMOTO, T; YAMANAKA, M et al.NEC research & development. 1988, Num 91, pp 65-72, issn 0547-051XArticle

Choosing an automatic component distribution system for hybrid circuit manufacturingPELLATON, J. P; GABUS, J.-C.Electri.onics. 1983, Vol 29, Num 7, pp 43-47, issn 0745-4309Article

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