Intelligent packaging: Concepts and applicationsYAM, Kit L; TAKHISTOV, Paul T; MILTZ, Joseph et al.Journal of food science. 2005, Vol 70, Num 1, pp R1-R10, issn 0022-1147Article

Failure mechanisms in active surface mount componentsRICHARDS, B. P; FOOTNER, P. K.GEC journal of research. 1990, Vol 7, Num 3, pp 146-156, issn 0264-9187, 11 p.Article

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Ceramic packages for liquid-nitrogen operationTONG, H. -M; YEH, H. L; GOLDBLATT, R. D et al.I.E.E.E. transactions on electron devices. 1989, Vol 36, Num 8, pp 1521-1527, issn 0018-9383, 7 p.Article

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Ball grid array reliability assessment for aerospace applicationsGHAFFARIAN, R; KIM, N. P.SPIE proceedings series. 1997, pp 396-401, isbn 0-930815-50-5Conference Paper

Packaging and integration of high-speed optical componentsRAY, Curtis.IEEE instrumentation & measurement magazine. 2004, Vol 7, Num 2, pp 60-62, issn 1094-6969, 3 p.Article

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Packaging des circuits intégrés = Integrated circuits packagingSAINT MARTIN, Xavier.Techniques de l'ingénieur. Electronique. 2005, Vol E5, Num E3400, issn 0399-4120, E3400.1-E3400.24Article

Very high speed 3D system in packageVAL, Christian; VASSAL, Marie-Cécile; LIGNIER, Olivier et al.SPIE proceedings series. 2002, pp 181-187, isbn 0-930815-66-1, 7 p.Conference Paper

Hollow packaging technology employing photosensitive adhesive resinsFUNAYA, Takuo; SENBA, Naoji; MATSUI, Koji et al.SPIE proceedings series. 2000, pp 190-195, isbn 0-930815-62-9Conference Paper

Variation mapsSEZAI DOGDU; SANTOS, Daryl L; CHAN, Raymond et al.SPIE proceedings series. 2000, pp 156-160, isbn 0-930815-62-9Conference Paper