SOUDOBRASAGE ET BRASAGE. IV = BRAZE WELDING, BRAZING AND SOLDERING. IVGERBEAUX H.1983; SOUDER; ISSN 0038-173X; FRA; DA. 1983; VOL. 5; NO 1; PP. 2-6; LOC. ISArticle

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallizationZHONG, W. H; CHAN, Y. C; WU, B. Y et al.Journal of materials science. 2007, Vol 42, Num 13, pp 5239-5247, issn 0022-2461, 9 p.Article

THEORY AND PRACTICE OF LIQUID-SOLID METAL REACTIONS WITH PARTICULAR REFERENCE TO JOINING PROCESSES = THEORIE ET PRATIQUE DES REACTIONS DU METAL LIQUIDE-SOLIDE, EN RELATION PLUS PARTICULIEREMENT AVEC LES PROCEDES D'ASSEMBLAGEPASCOE G.1975; IN: 2ND INTERNATION. BRAZING AND SOLDERING CONF. LONDON, 29-31 OCTOBER 1975; WANTAGE; BR. ASSOC. BRAZING AND SOLDERING; DA. 1975; PP. (5 P.)Conference Paper

Gefügeentwicklung durch Wärmebehandlung an Maonesiumlötverbindungen = Microstructure development by thermal treatment on soldered magnesium jointsWIELAGE, Bernhard; MÜCKLICH, Silke.Praktische Metallographie. 2007, Vol 44, Num 7, pp 307-316, issn 0032-678X, 10 p.Article

Reflow of AuSn Solder Creates Strong JointsGOLOSKER, Ilya; FLORANDO, Jeffrey.Welding journal. 2013, Vol 92, Num 2, pp 48-59, issn 0043-2296, 12 p.Article

Soldering technology: a decade of developments = Technologie du brasage tendre: une décennie de développementsTHWAITES, C. J.International metals reviews. 1984, Vol 29, Num 2, pp 45-74, issn 0308-4590Article

Soldering technology for the 80's. II = Technologie du brasage tendre dans les années 1980. IIRUBIN, W; BEEFERMAN, D. C; DUNNINGHAM, J et al.Welding brazing soldering. AWS annual meeting. AWS-WRC conference. 1984, pp 207-213Conference Paper

A flux for soldering with zinc soldersSHCHERBEDINSKAYA, A.V; KLEVTSOVA, E.V; FEDOROV, V.N et al.Welding Production. 1985, Vol 32, Num 5, pp 28-29, issn 0043-230XArticle

SPECIAL FEATURES OF THE FILLING OF A HORIZONTAL GAP WITH A SOLDERING ALLOY DURING ISOTHERMAL CONTACT = CARACTERISTIQUES DU REMPLISSAGE D'UN JEU HORIZONTAL AVEC UN METAL D'APPORT DE BRASAGE TENDRE AVEC CONTACT ISOTHERMELASHKO SV; NAGAPETYAN IG.1980; WELDG PRODUCT.; ISSN 0043-230X; GBR; DA. 1980; VOL. 27; NO 8; PP. 32-34; BIBL. 3 REF.; DE RUS; LOC. IS;[SVAR PROIZVOD; SUN; DA. 1980; NO 8; PP. 25-26]Article

DEPENDENCE OF THE CHARACTER OF FAILURE OF NON CAPILLARY SOLDERED JOINTS ON THE TECHNOLOGY OF STEEL SOLDERING WITH A BRASS SOLDERSHAPIRO AE; KARAKOZOV EH S; KUDRIN NA et al.1979; SVAR. PROIZVOD.; ISSN 0491-6441; SUN; DA. 1979; NO 4; PP. 27-29; BIBL. 2 REF.; LOC. ISArticle

Some metallurgical aspects of SMD technology = Aspects métallurgiques de la technologie des composants montés en surfaceTHWAITES, C. J.1986, Num 10, pp 38-42, issn 0263-0060Article

Solderability of capacitor lead wires = Aptitude au brasage tendre de conducteurs de condensateursGEIGER, A. L.1986, Num 11, pp 56-61, issn 0263-0060Article

Analysis of ring and plug shear strengths for comparison of lead-free soldersFOLEY, J. C; GICKLER, A; LEPREVOST, F. H et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1258-1263, issn 0361-5235Conference Paper

NEW PROCESS FOR ALUMINIUM JOINING = NOUVELLE METHODE D'ASSEMBLAGE DE L'ALUMINIUM1972; CANAD. WELDER FABRICATOR; CANADA; DA. 1972; VOL. 63; NO 10; PP. 19Serial Issue

ARE THE SOLDERING AND BRAZING FUMES DANGEROUS TO HEALTH. = LES FUMEES DE BRASAGE SONT-ELLES DANGEREUSES POUR LA SANTE.KOSNAC L.1979; INTERNATIONAL BRAZING SOLDERING CONFERENCE. 3/1979/LONDON; GBR; LONDON: METALS SOCIETY; DA. 1979; 9 P.; LOC. ISConference Paper

Le fer et la soudure dans une seule main = A compact soldering ironCOLOMBIER, A.Industries et techniques (1960). 1984, Num 529, issn 0150-6617, 71Article

On the non-occurrence of tin pest in tin-silver-indium soldersSEMENOVA, Olga; FLANDORFER, Hans; IPSER, Herbert et al.Scripta materialia. 2005, Vol 52, Num 2, pp 89-92, issn 1359-6462, 4 p.Article

Recent advances in removing electronic flux residues = Développements récents dans le domaine de l'élimination des résidus de flux dans l'industrie électroniquePASCOE, G.1984, Num 6, pp 30-31, issn 0263-0060Article

Challenges in attaining lead-free soldersBASKIN, Philip.Welding journal. 2007, Vol 86, Num 3, pp 58-61, issn 0043-2296, 4 p.Article

SIPAD verspricht höhere Qualität zum kleineren Preis: Leiterplatten mit Massivlotdepot setzen sich durch = SIPAD promises a higher quality at a lower priceMAIWALD, W. J.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1995, Vol 103, Num 7-8, pp 413-418, issn 0944-1018, 5 p.Article

Evaluating the wetting of materials by solders using scanning meniscography = Evaluation par méniscographie en continu du mouillage de matériaux par des métaux d'apport de brasage tendrePODLESNYKH, V. G; TKACHEV, M. A.Welding Production. 1984, Vol 31, Num 7, pp 49-52, issn 0043-230XArticle

Induction Soldering Gets Maglev Vehicle on TrackHOLKO, Kenneth H.Welding journal. 2009, Vol 88, Num 4, pp 53-57, issn 0043-2296, 5 p.Article

Einfluss der Lotzusammensetzung auf die Gefügeentwicklung in Magnesium-Lötverbindungen = The influence of solder composition on the development of microstructures in magnesium solder jointsWIELAGE, Bernhard; MüCKLICH, Silke.Praktische Metallographie. 2005, Vol 42, Num 10, pp 513-527, issn 0032-678X, 15 p.Article

Filler materials : the current situation and future trends with particular reference to lead-free soldering alloysZACCARIA, B.Welding international. 2001, Vol 15, Num 7, pp 545-550, issn 0950-7116Article

Analyse der Lötbarkeit einer Silber-Dickschichtmetallisierung unter besonderer Berücksichtigung der Grenzflächenreaktionen beim Löten = Etude de la brasabilité de revêtements épais en argent en tenant compte des réactions à l'interface lors du brasage = Study of the solderability of a silver thick costing taking in account the boundary layer reactions during solderingFASCHING, G; WIEDERMANN, W.Verbindungstecknik in der Elektronik. Internationales kolloquium. 1986, pp 38-43Conference Paper