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Results 1 to 25 of 215104

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LOCMOS LENDS ITSELF TO FULL SCALE INTEGRATION.BEER A.1977; NEW ELECTRON; G.B.; DA. 1977; VOL. 10; NO 3; PP. 28-32 (3P.)Article

C2L: A NEW HIGH-SPEED HIGH-DENSITY BULK CMOS TECHNOLOGY.DINGWALL AGF; STRICKER RE.1977; I.E.E.E. J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1977; VOL. 12; NO 4; PP. 344-349; BIBL. 8 REF.Article

NEW CMOS TECHNOLOGIESHOEFFLINGER B; ZIMMER G.1980; CONF. SER.-INST. PHYS.; ISSN 0305-2346; GBR; DA. 1980 PUBL. 1981; NO 57; PP. 85-139; BIBL. 2 P.Conference Paper

DEVICE TECHNOLOGY. ADVANCED DEVICE AND PROCESSING CONCEPTS1979; IEDM 1979. INTERNATIONAL ELECTRON DEVICES MEETING/1979/WASHINGTON DC; USA; NEW YORK: IEEE; DA. 1979; PP. 575-604; BIBL. DISSEM.Conference Paper

TECHNOLOGY OF A NEW N-CHANNEL ONE-TRANSISTOR EAROM CELL CALLED SIMOS.SCHEIBE A; SCHULTE H.1977; I.E.E.E. TRANS-ELECTRON DEVICES; U.S.A.; DA. 1977; VOL. 24; NO 5; PP. 600-606; BIBL. 7 REF.Article

COMPLEMENTARY DMOS PROCESS FOR LSI.MASUHARA T; MULLER RS.1976; I.E.E.E. J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1976; VOL. 11; NO 4; PP. 453-458; BIBL. 3 REF.Article

MOS PROCESSES1978; I.E.E.E. TRANS. CONSUMER ELECTRON.; USA; DA. 1978; VOL. 24; NO 2; PP. 155-167Article

POWER COMPONENTS MELD THE STRENGTHS OF MOS, BIPOLAROHR S.1980; ELECTRON. DESIGN; USA; DA. 1980; VOL. 28; NO 14; PP. 65-71Article

NEW MOS PROCESSES SET SPEED, DENSITY RECORDS.ALTMAN L.1977; ELECTRONICS; U.S.A.; DA. 1977; VOL. 50; NO 22; PP. 92-94Article

TECHNOLOGIE MOS AVEC UNE CHARGE POSITIVE NEGLIGEABLEHAYASHI Y; YOSHIHARA H.1976; BULL. ELECTROTECH. LAB.; JAP.; DA. 1976; VOL. 40; NO 4-5; PP. 429-432; ABS. ANGL.Article

A 6K-GATE CMOS GATE ARRAYTAGO H; KOBAYASHI T; KOBAYASHI M et al.1982; IEEE JOURNAL OF SOLID-STATE CIRCUITS; ISSN 0018-9200; USA; DA. 1982; VOL. 17; NO 5; PP. 907-912; BIBL. 7 REF.Article

A NEW CIRCUIT CONFIGURATION FOR A SINGLE-TRANSISTOR CELL USING AL-GATE TECHNOLOGY WITH REDUCED DIMENSIONS.MEUSBURGER G.1977; I.E.E.E.J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1977; VOL. 12; NO 3; PP. 253-257; BIBL. 9 REF.Article

MOS DEVICE AND TECHNOLOGY CONSTRAINTS IN VLSIYOUSSEF EL MANSY.1982; IEEE TRANS. ELECTRON DEVICES; ISSN 0018-9383; USA; DA. 1982; VOL. 29; NO 4; PP. 567-573; BIBL. 26 REF.Article

SILICON-GATE CMOS DEVICES WITH 300 A GATE OXIDESLINDENBERGER WS; TRETOLA AR; POWELL WD et al.1980; SOLID-STATE ELECTRON.; ISSN 0038-1101; GBR; DA. 1980; VOL. 23; NO 11; PP. 1179-1180; BIBL. 5 REF.Article

MIKROCOMPUTER-FAMILIE TMS-1000 = LA FAMILLE DE MICRO-ORDINATEURS TMS-1000GOESSLER R.1980; ELEKTRONIK (MUENCH.); ISSN 0013-5658; DEU; DA. 1980; VOL. 29; NO 20; PP. 103-104Article

CARACTERISTIQUES ACTUELLES ET EVOLUTION DE LA TECHNOLOGIE SILICIUM SUR ISOLANT (SSI)BOREL J.1978; ONDE ELECTR.; FRA; DA. 1978; VOL. 58; NO 12; PP. 812-817; ABS. ENG; BIBL. 25 REF.Article

CMOS PERFORMANCE, COST MAKE DIGITAL JUST PART OF ITS STORY1978; ELECTRON. DESIGN; USA; DA. 1978; VOL. 26; NO 23; PP. 52-56Article

AL2O3 AS A RADIATION-TOLERANT CMOS DIELECTRIC.SCHLESIER KM; SHAW JM; BENYON CW JR et al.1976; R.C.A. REV.; U.S.A.; DA. 1976; VOL. 37; NO 3; PP. 358-388; BIBL. 24 REF.Article

MOS BI-POLAR. THE DEBATE.OWEN SJT.1974; MICROELECTRONICS; G.B.; DA. 1974; VOL. 6; NO 2; PP. 3-4Article

PROPOSER FOR MOS TECHNOLOGY. OPENING STATEMENT.CARLSON RS.1974; MICROELECTRONICS; G.B.; DA. 1974; VOL. 6; NO 2; PP. 5-8Article

SECONDER FOR MOS TECHNOLOGY. MOS A MAJOR FACTOR.FORTE S.1974; MICROELECTRONICS; G.B.; DA. 1974; VOL. 6; NO 2; PP. 14-17Article

SCHNELLE STATISCHE RAM-BAUSTEINE = COMPOSANTS RAM STATIQUES RAPIDESCAPECE RP.1979; ELEKTRONIK; DEU; DA. 1979; VOL. 28; NO 20; PP. 39-50; BIBL. 3 REF.Article

CUSTOM INTEGRATED CIRCUITSREHMAN MA.1980; ELECTRON. ENG.; ISSN 0013-4902; GBR; DA. 1980; VOL. 52; NO 636; PP. 55-68; (7 P.)Article

FIVE TECHNOLOGIES SQUEEZING MORE PERFORMANCE FROM LSI CHIPS.ALTMAN L.1977; ELECTRONICS; U.S.A.; DA. 1977; VOL. 50; NO 17; PP. 91-112Article

QUALITY AND RELIABILITY OF COS/MOS.FERRIANI O.1977; NEW ELECTRON.; G.B.; DA. 1977; VOL. 10; NO 8; PP. 21-25 (3P.)Article

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