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Results 1 to 25 of 191122

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Évolution des drones: Une vue d'ensemble : Les dronesRICQUE, Bertrand.REE. Revue de l'électricité et de l'électronique. 2014, Num 3, pp 30-35, issn 1265-6534, 6 p.Article

Generalized Inference for Measuring Process Yield With the Contamination of Measurement Errors— Quality Control for Silicon Wafer Manufacturing Processes in the Semiconductor IndustryWU, Chien-Wei; LIAO, Mou-Yuan.IEEE transactions on semiconductor manufacturing. 2012, Vol 25, Num 2, pp 272-283, issn 0894-6507, 12 p.Article

The 2002 to 2010 Mask Survey Trend AnalysisHUGHES, Greg; CHAN, David.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7985, issn 0277-786X, isbn 978-0-8194-8553-3, 798502.1-798502.12Conference Paper

Mask Industry Assessment: 2010HUGHES, Greg; CHAN, David Y.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7823, issn 0277-786X, isbn 978-0-8194-8337-9, Part I, 782303.1-782303.13 [13 p.], 2Conference Paper

An update from the consumer electronics associationMARKWALTER, Brian.SMPTE motion imaging journal. 2008, Vol 117, Num 6, pp 71-74, issn 1545-0279, 4 p.Article

Identification and Cost Estimation of WIP Bubbles in a FabHASSOUN, Michael; RABINOWITZ, Gad; LACHS, Shlomi et al.IEEE transactions on semiconductor manufacturing. 2008, Vol 21, Num 2, pp 217-223, issn 0894-6507, 7 p.Article

Mask Industry Assessment: 2008HUGHES, Greg; YUN, Henry.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7122, issn 0277-786X, isbn 978-0-8194-7355-4 0-8194-7355-3, 712204.1-712204.12, 2Conference Paper

Role of residual stress on crack penetration and deflection at a bimaterial interface in a 4-point bend testROHAM, S; HIGHT, T.Microelectronic engineering. 2007, Vol 84, Num 1, pp 72-79, issn 0167-9317, 8 p.Article

A comprehensive test of optical scatterometry readiness for 65 nm technology productionUKRAINTSEV, Vladimir A.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6195-4, 2Vol, vol 1, 61521G.1-61521G.13Conference Paper

An overview of the competitive and adversarial approaches to designing dynamic power management strategiesIRANI, Sandy; SINGH, Gaurav; SHUKLA, Sandeep K et al.IEEE transactions on very large scale integration (VLSI) systems. 2005, Vol 13, Num 12, pp 1349-1361, issn 1063-8210, 13 p.Article

From colloids to nanotechnology (Budapest, 2002)Zrinyi, Miklos; Horvölgyi, Zoltan D.Progress in colloid & polymer science. 2004, issn 0340-255X, isbn 3-540-0658-1, VIII, 225 p, isbn 3-540-0658-1Conference Proceedings

Touchless 300mm fab production in the modern business environment : challenges in product integration and manufacturing execution for operational flexibilityBURDA, Rich; COLWILL, Bryant; LIANG, Frank et al.IEEE / SEMI advanced semiconductor manufacturing conference. 2004, pp 262-266, isbn 0-7803-8312-5, 1Vol, 5 p.Conference Paper

Le marché japonais en forme = Japanese market is at the top of its formFERRARI, Thierry.Technologies internationales (Strasbourg). 2003, Num 93, pp 11-14, issn 1165-8568, 4 p.Article

New quality cost models to optimize inspection strategiesOPPERMANN, Martin; SAUER, Wilfried; WOHLRABE, Heinz et al.IEEE transactions on electronics packaging manufacturing. 2003, Vol 26, Num 4, pp 328-337, issn 1521-334X, 10 p.Article

IEEE Lester Eastman conference on high performance devices (Newark DE, 6-8 August 2002)Leoni, Robert E.IEEE Lester Eastman conference on high performance devices. 2002, isbn 0-7803-7478-9, XIII, 508 p, isbn 0-7803-7478-9Conference Proceedings

Virtual test reduces semiconductor product development timeHOGAN, T; HEFFERNAN, D.Electronics & communication engineering journal. 2001, Vol 13, Num 2, pp 77-83, issn 0954-0695Article

The future of equipment development and semiconductor productionMAYDAN, Dan.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2001, Vol 302, Num 1, pp 1-5, issn 0921-5093Conference Paper

Ecological metaphors color future MEMS perspectivesJONES-BEY, Hassaun.Laser focus world. 2001, Vol 37, Num 1, pp 122-128, issn 1043-8092Article

Analysis of five residential-Consumer end-of-life electronics collection programsGLAZEBROOK, B; BELING, C.MEIE '2000 : matériels electriques industriels et l'environnement. Conférence européenne. 2000, pp 155-160, isbn 2-912328-14-4Conference Paper

Examples for re-use of electronic equipmentPEETERMANS, A.MEIE '2000 : matériels electriques industriels et l'environnement. Conférence européenne. 2000, pp 101-104, isbn 2-912328-14-4Conference Paper

L'électronique reconfigure l'automobile = Electronics reconfigures carsLOUIN, André.Ingénieurs de l'automobile (Paris). 2000, Num 737, pp 34-56, issn 0020-1200, 23 p.Serial Issue

Elektronik im Kraftfahrzeug (Baden-Baden, 5-6 Oktober 2000) = Electronic systems for vehiclesVDI-Berichte. 2000, issn 0083-5560, isbn 3-18-091547-1, 1226 p., isbn 3-18-091547-1Conference Proceedings

Embedded systems education for the future : Electrical and computer engineering educationWOLF, W; MADSEN, J.Proceedings of the IEEE. 2000, Vol 88, Num 1, pp 23-30, issn 0018-9219Article

Evolution : the best possible search algorithm?STENTIFORD, F. W.BT technology journal. 2000, Vol 18, Num 1, pp 44-45, issn 1358-3948Article

A continent prepares to emerge as a playerALLAN, R.Electronic design. 1999, Vol 47, Num 1, pp 120-121, issn 0013-4872Article

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