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Quantitative LGA/substrate assembly contact study from pressure sensitive film measurementsWEI ZOU; LONGWORTH, Hai.SPIE proceedings series. 2003, pp 807-812, isbn 0-8194-5189-4, 6 p.Conference Paper

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New wafer level structure for stress free area array solder attachFILLION, R; MEYER, L; DUROCHER, K et al.SPIE proceedings series. 2003, pp 687-692, isbn 0-8194-5189-4, 6 p.Conference Paper

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Triple-stack anodic bonding for MEMS applicationsDRAGOI, V; GLINSNER, T; HANGWEIER, P et al.Proceedings - Electrochemical Society. 2003, pp 329-336, issn 0161-6374, isbn 1-56677-402-0, 8 p.Conference Paper

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Auto wedge bonding to GaAs MMICsTAI, T; DELUMPA, K.SPIE proceedings series. 1997, pp 267-271, isbn 0-930815-50-5Conference Paper

Design guidelines to implement Six Sigma in assembly process yield of area array solder interconnect packagesCHUNHO KIM; BALDWIN, Daniel F.Proceedings - Electronic Components Conference. 2002, pp 1560-1568, issn 0569-5503, isbn 0-7803-7430-4, 9 p.Conference Paper