Solder balling of lead-free solder pastesARRA, Minna; SHANGGUAN, Dongkai; RISTOLAINEN, Eero et al.Journal of electronic materials. 2002, Vol 31, Num 11, pp 1130-1138, issn 0361-5235, 9 p.Conference Paper

Evaluation of lead free soldering development by means of a holistic considerationTÜRPE, M.Advanced engineering materials (Print). 2006, Vol 8, Num 3, issn 1438-1656, 138, 161-164 [5 p.]Conference Paper

Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomographyLING JIANG; CHAWLA, Nikhilesh; PACHECO, Mario et al.Materials characterization. 2011, Vol 62, Num 10, pp 970-975, issn 1044-5803, 6 p.Article

Coupling effect in Pt/Sn/Cu sandwich solder joint structuresWANG, S. J; LIU, C. Y.Acta materialia. 2007, Vol 55, Num 10, pp 3327-3335, issn 1359-6454, 9 p.Article

Enthalpy of mixing of liquid systems for lead free soldering: Ni―Sb―Sn systemELMAHFOUDI, A; FÜRTAUER, S; SABBAR, A et al.Thermochimica acta. 2012, Vol 534, pp 33-40, issn 0040-6031, 8 p.Article

Wetting characteristics of Cu―xZn layers for Sn―3.0Ag―0.5Cu soldersJI HYUN LEE; YOUNG MIN KIM; JI HWAN HWANG et al.Journal of alloys and compounds. 2013, Vol 567, pp 10-14, issn 0925-8388, 5 p.Article

Delamination by reheating in SMD solder joint using lead-free solder : Packaging technologyMOMOKAWA, Yuki; ISHIZUKA, Naomi.NEC research & development. 2003, Vol 44, Num 3, pp 251-255, issn 0547-051X, 5 p.Article

Microstructure of a lead-free composite solder produced by an in-situ processHWANG, Seong-Yong; LEE, Joo-Won; LEE, Zin-Hyoung et al.Journal of electronic materials. 2002, Vol 31, Num 11, pp 1304-1308, issn 0361-5235, 5 p.Conference Paper

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowLIUKKONEN, Timo; NUMMENPÄÄ, Pekka; TUOMINEN, Aulis et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 44-47, issn 0954-0911, 4 p.Article

Electrochemical co-deposition of ternary Sn-Bi-Cu films for solder bumping applicationsJOSEPH, Shany; PHATAK, Girish J; GURUNATHAN, K et al.Journal of applied electrochemistry. 2006, Vol 36, Num 8, pp 907-912, issn 0021-891X, 6 p.Article

Variable-Size Solder Droplets by a Molten-Solder Ejection MethodYOKOYAMA, Yoshinori; ENDO, Kazuyo; IWASAKI, Toshihiro et al.Journal of microelectromechanical systems. 2009, Vol 18, Num 2, pp 316-321, issn 1057-7157, 6 p.Article

Improvement of flux-less, lead-free solder wettability on CF₄-plasma-fluorinated Sn and Ag substrates using 'atmospheric pressure non-equilibrium plasma'UESHIMA, Masato; NAKAMURA, Yusuke; HORII, Shingo et al.Surface & coatings technology. 2010, Vol 205, issn 0257-8972, S426-S430, SUP1Conference Paper

CF₄ fluorination onto Cu surface using atmospheric pressure non-equilibrium plasma for flux-less soldering with lead free solderUESHIMA, Masato; NAKAMURA, Yusuke; HORII, Shingo et al.Surface & coatings technology. 2011, Vol 206, Num 5, pp 934-937, issn 0257-8972, 4 p.Conference Paper

Suppression of tin whisker formation on fine pitch connectors by surface rougheningTAKEUCHI, Makoto; KAMIYAMA, Kouichi; SUGANUMA, Katsuaki et al.Journal of electronic materials. 2006, Vol 35, Num 11, pp 1918-1925, issn 0361-5235, 8 p.Conference Paper

Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn―0.7Cu solder alloy and copper substrateSATYANARAYAN; PRABHU, K. N.Journal of materials science. Materials in electronics. 2012, Vol 23, Num 9, pp 1664-1672, issn 0957-4522, 9 p.Article

Wetting Kinetics of Eutectic Lead and Lead-Free Solders : Spreading over the Cu SurfaceHUI ZHAO; REDDY NALAGATLA, Dinesh; SEKULIC, Dusan P et al.Journal of electronic materials. 2009, Vol 38, Num 2, pp 284-291, issn 0361-5235, 8 p.Conference Paper

Effect of ni on the formation of Cu₆Sn₅ and Cu₃Sn intermetallicsHAO YU; VUORINEN, Vesa; KIVILAHTI, Jorma et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 4, pp 293-298, issn 1521-334X, 6 p.Article

Effect of Purging Gas on Wetting Behavior of Sn-3.5Ag Lead-Free Solder on Nickel-Coated Aluminum SubstratePRABHU, K. N; VARUN, M; SATYANARAYAN et al.Journal of materials engineering and performance. 2013, Vol 22, Num 3, pp 723-728, issn 1059-9495, 6 p.Article

Effects of rare earth Ce on properties of Sn―9Zn lead-free solderWENXUE CHEN; SONGBAI XUE; HUI WANG et al.Journal of materials science. Materials in electronics. 2010, Vol 21, Num 7, pp 719-725, issn 0957-4522, 7 p.Article

Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structureWANG, S. J; LIU, C. Y.Journal of electronic materials. 2003, Vol 32, Num 11, pp 1303-1309, issn 0361-5235, 7 p.Article

Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

Soldering properties and interfacial microstructure of CSP solder joints with lower melting lead-free solderYAMAGUCHI, Atsushi; YAMASHITA, Yuhei; FURUSAWA, Akio et al.Journal of microelectronics and electronic packaging. 2005, Vol 2, Num 3, pp 208-216, issn 1551-4897, 9 p.Article

Pb-Free Synthesis: Decision Matrix as a Tool for Alloy SelectionQUINTERO, Pedro O; VALENTIN, Ricky; MA, David et al.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 1, pp 25-34, issn 1551-4897, 10 p.Article

Calorimetric investigation of the binary Cu-In systemKNOTT, S; MIKULA, A.International journal of materials research. 2006, Vol 97, Num 8, pp 1098-1101, issn 1862-5282, 4 p.Article