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Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixingTAY, S. L; HASEEB, A. S. M. A; MOHD RAFIE JOHAN et al.Soldering & surface mount technology. 2011, Vol 23, Num 1, pp 10-14, issn 0954-0911, 5 p.Article

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates : RECENT RESEARCH ADVANCES IN Pb-FREE SOLDERSWANG, Y. W; LIN, Y. W; KAO, C. R et al.Microelectronics and reliability. 2009, Vol 49, Num 3, pp 248-252, issn 0026-2714, 5 p.Article

Dissolution of copper on Sn-Ag-Cu system lead free solderIZUTA, Goro; TANABE, Tsuyoshi; SUGANUMA, Katsuaki et al.Soldering & surface mount technology. 2007, Vol 19, Num 2, pp 4-11, issn 0954-0911, 8 p.Article

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Activities during melting and reflowing behaviour of soldersMITTAL, J; LIN, K. L.Soldering & surface mount technology. 2010, Vol 22, Num 1, pp 4-10, issn 0954-0911, 7 p.Article

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Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn―0.7Cu solder alloy and copper substrateSATYANARAYAN; PRABHU, K. N.Journal of materials science. Materials in electronics. 2012, Vol 23, Num 9, pp 1664-1672, issn 0957-4522, 9 p.Article

Effect of PCB surface finish on creep properties of lead-free solder jointsSUNDELIN, Janne J; NURMI, Sami T; LEPISTÖ, Toivo K et al.Soldering & surface mount technology. 2005, Vol 17, Num 4, pp 3-9, issn 0954-0911, 7 p.Article

Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnectionsDUNFORD, Steven; CANUMALLA, Sridhar; VISWANADHAM, Puligandla et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 726-736Conference Paper

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallizationZHONG, W. H; CHAN, Y. C; WU, B. Y et al.Journal of materials science. 2007, Vol 42, Num 13, pp 5239-5247, issn 0022-2461, 9 p.Article