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Results 1 to 25 of 159077

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A new mathematical model for semiconductor-on-insulator structuresLAI, P. T.Solid-state electronics. 1990, Vol 33, Num 4, pp 441-444, issn 0038-1101, 4 p.Article

The Ge condensation technique: A solution for planar SOI/GeOI co-integration for advanced CMOS technologies?VINCENT, B; DAMLENCOURT, J. F; CAMPIDELLI, Y et al.Materials science in semiconductor processing. 2008, Vol 11, Num 5-6, pp 205-213, issn 1369-8001, 9 p.Conference Paper

Performance enhancement of partially and fully depleted strained-SOI MOSFETsNUMATA, Toshinori; IRISAWA, Toshifumi; TAKAGI, Shin-Ichi et al.I.E.E.E. transactions on electron devices. 2006, Vol 53, Num 5, pp 1030-1038, issn 0018-9383, 9 p.Article

A New Method to Extract Bulk Carrier Mobility in Germanium-on-InsulatorJIN, Hai-Yan; CHEUNG, Nathan W.I.E.E.E. transactions on electron devices. 2008, Vol 55, Num 5, pp 1250-1254, issn 0018-9383, 5 p.Article

Mobility Scaling in Short-Channel Length Strained Ge-on-Insulator P-MOSFETsBEDELL, Stephen W; MAJUMDAR, Amlan; OTT, John A et al.IEEE electron device letters. 2008, Vol 29, Num 7, pp 808-810, issn 0741-3106, 3 p.Article

Low resistivity SOI for substrate crosstalk reductionANKARCRONA, J; VESTLING, L; EKLUND, K.-H et al.I.E.E.E. transactions on electron devices. 2005, Vol 52, Num 8, pp 1920-1922, issn 0018-9383, 3 p.Article

Compressor technologies for low temperature applications of R-22DIAB, T. A. R; GEPHART, J.International journal of refrigeration. 1991, Vol 14, Num 1, pp 5-9, issn 0140-7007, 5 p.Article

Inherently planar fully depleted SOI isolationBURNS, J; COSTA, C; WARNER, K et al.IEEE International SOI conference. 2002, pp 103-104, isbn 0-7803-7439-8, 2 p.Conference Paper

Silicon-on-insulator by wafer bonding : a reviewMASZARA, W. .P.Journal of the Electrochemical Society. 1991, Vol 138, Num 1, pp 341-347, issn 0013-4651Article

Improved SOI image sensor design based on backside illumination on silicon-on-sapphire (SOS) substrateCHAO SHEN; CHEN XU; HUANG, R et al.IEEE International SOI conference. 2002, pp 73-74, isbn 0-7803-7439-8, 2 p.Conference Paper

SOI-specific tri-state inverter and its applicationKIM, Jae-Joon; ROY, Kaushik.IEEE International SOI conference. 2002, pp 145-146, isbn 0-7803-7439-8, 2 p.Conference Paper

Breakdown Behavior of 40-nm PD-SOI NMOS Device Considering STI-Induced Mechanical Stress EffectSU, V. C; LIN, I. S; KUO, J. B et al.IEEE electron device letters. 2008, Vol 29, Num 6, pp 612-614, issn 0741-3106, 3 p.Article

Recesseed source-drain (S/D) SOI MOSFETs with low S/D extension (SDE) external resistanceAHN, C. G; CHO, W. J; IM, K. J et al.IEEE international SOI conference. 2004, pp 207-208, isbn 0-7803-8497-0, 1Vol, 2 p.Conference Paper

Imaging of the SOI interface by high resolution electron microscopyYONG YAN; FUQUAN JI; JUN CHEN et al.Physica status solidi. A. Applied research. 1988, Vol 110, Num 1, pp K25-K28, issn 0031-8965Article

Measurement of in-plane and depth strain profiles in strained-Si substratesOGURA, Atsushi; KOSEMURA, Daisuke; YAMASAKI, Kosuke et al.Solid-state electronics. 2007, Vol 51, Num 2, pp 219-225, issn 0038-1101, 7 p.Conference Paper

Entwicklungstendenzen in der Herstellung von Dämmaterialien und in ihrem Einsatz im Bauwesen und in der industrie = Tendances de développement dans le domaine de matériaux isolants et leur utilisation dans le bâtiment et l'industrie = Development trends of insulating materials and of their use in buildings and industrial applicationsGURGEN, E.-M; MULLER, T.Energieanwendung. 1983, Vol 32, Num 6, pp 211-213, issn 0013-7405Article

ETUDE D'UN PROCEDE D'ISOLEMENT DE CAISSONS POUR CIRCUITS INTEGRES RAPIDES.CHAUTEMPS J.1977; ; S.L.; DA. 1977; PP. 1-86; BIBL. 14 REF.; (THESE DOCT. 3E. CYCLE, SPEC. PHYS., MENTION ELECTRON.; PIERRE ET MARIE CURIE PARIS 6)Thesis

Gate capacitances behavior of nanometer FD SOI CMOS devices with HfO2 high-k gate dielectric considering vertical and fringing displacement effects using 2-D simulationLIN, Yu-Sheng; LIN, Chia-Hong; KUO, James B et al.I.E.E.E. transactions on electron devices. 2006, Vol 53, Num 6, pp 1373-1378, issn 0018-9383, 6 p.Article

300 mm SGOI/Strain-Si for high-performance CMOSREZNICEK, A; BEDELL, S. W; HOVEL, H. J et al.IEEE international SOI conference. 2004, pp 37-38, isbn 0-7803-8497-0, 1Vol, 2 p.Conference Paper

A 12dBm 320GHz GBW distributed amplifier in a 0.12μm SOI CMOSKIM, Jonghae; PLOUCHART, Jean-Olivier; ZAMDMER, Noah et al.IEEE International Solid-State Circuits Conference. 2004, pp 478-479, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

Time and Frequency Domain Characterization of Transistor Self-HeatingMAKOVEJEV, Sergej; OLSEN, Sarah H; KILCHYTSKA, Valeriya et al.I.E.E.E. transactions on electron devices. 2013, Vol 60, Num 6, pp 1844-1851, issn 0018-9383, 8 p.Article

Papers Selected from the EUROSOI 2010 ConferenceCLERC, Raphaël; FAYNOT, Olivier.Solid-state electronics. 2011, Vol 59, Num 1, issn 0038-1101, 69 p.Conference Proceedings

Optimisation of trench isolated bipolar transistors on SOI substrates by 3D electro-thermal simulationsNIGRIN, S; ARMSTRONG, G. A; KRANTI, A et al.Solid-state electronics. 2007, Vol 51, Num 9, pp 1221-1228, issn 0038-1101, 8 p.Article

Selectively-formed high mobility SiGe-on-Insulator pMOSFETs with Ge-rich strained surface channels using local condensation techniqueTEZUKA, Tsutomu; NAKAHARAI, Shu; MORIYAMA, Yoshihiko et al.Symposium on VLSI Technology. sd, pp 198-199, isbn 0-7803-8289-7, 1Vol, 2 p.Conference Paper

A 2.5V 14-bit ΣΔ CMOS-SOI capacitive accelerometerAMINI, Babak Vakili; POURKAMALI, Siavash; AYAZI, Farrokh et al.IEEE International Solid-State Circuits Conference. 2004, pp 314-315, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

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