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Consumer and environmental pressures on the use of lead glazes and coloursCUBBON, R. C. P.Interceram. 1994, Vol 43, Num 4, pp 240-242, issn 0020-5214Article

Lead-free solder bump technologies for flip-chip electronic packaging applicationsKARIM, Zaheed S; CHOW, Alice; CHEUNG, Edwin et al.SPIE proceedings series. 2002, pp 570-575, isbn 0-8194-4500-2, 2VolConference Paper

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Meet reformulated fuels sulfur levels without breaking the bankEDGAR, D; BOSLAND, C; MOORE, A et al.Fuel reformulation. 1994, Vol 4, Num 3, pp 32-34, issn 1062-3744Article

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Experiments and simulations of uniaxial ratchetting deformation of Sn-3Ag-0.5Cu and Sn-37Pb solder alloysKOBAYASHI, Takuji; SASAKI, Katsuhiko.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 4, pp 343-353, issn 0957-4522, 11 p.Article

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Efectos de altas presiones de vapor de gasolina en la operación de equipos de recuperación de vapor de gasoline = Effects of high-pressure gasoline fumes on equipment operation for gasoline fumes recoveryTUTTLE, W.N.Oilgas. 1996, Vol 29, Num 344, pp 55-58, issn 0030-1493Article

Worldwide refiners face key regulatory and economic challengesMCSPADDEN, C.L.Fuel reformulation. 1995, Vol 05, Num 06, pp 35-40, issn 1062-3744, 5 p.Article