Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance
- Auteur
- CHEIN, Reiyu1 ; CHEN, Janghwa1
[1] Department of Mechanical Engineering, National Chung Hsing University, 250 Kuo-Kuang Rd., Taichung City 402, Taiwan, Province of China - Source
International journal of thermal sciences. 2009, Vol 48, Num 8, pp 1627-1638, 12 p ; ref : 23 ref
- Editeur
- Elsevier, Kidlington
- Pays de publication
- United Kingdom
- Type de document
- Article
- Langue
- English
- Mot clé auteur
- Inlet/outlet arrangements Microchannel heat sink Pressure drop coefficient Thermal resistance Velocity and temperature maldistribution
- Mot clé (fr)
- Champ température Champ écoulement Composant électronique Configuration géométrique Dissipateur thermique Microstructure Modélisation Méthode volume fini Perte charge Résistance thermique Simulation numérique Système refroidissement Transfert chaleur Microcanal
- Mot clé (en)
- Temperature distribution Flow field Electronic component Geometrical configuration Heat sink Microstructure Modeling Finite volume method Pressure drop Thermal resistance Numerical simulation Cooling system Heat transfer Microchannel
- Mot clé (es)
- Campo temperatura Campo flujo Componente electrónico Configuración geométrica Disipador térmico Microestructura Modelización Método volumen finito Pérdida carga Resistencia térmica Simulación numérica Sistema enfriamiento Transferencia térmica
- Classification
- Pascal
- 001 Sciences exactes et technologie / 001D Sciences appliquees / 001D03 Electronique / 001D03F Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide / 001D03F06 Circuits intégrés / 001D03F06A Conception. Technologies. Analyse fonctionnement. Essais
- Discipline
- Electronics
- Provenance
- Inist-CNRS
- Base de données
- PASCAL
- Identifiant INIST
- 21543456
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1016/j.ijthermalsci.2008.12.019 
https://dx.doi.org/10.1016/j.ijthermalsci.2008.12.019
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