Stretchable copper interconnects with three-dimensional coiled structures
- Auteur
- CHAN WOO PARK1 ; SOON WON JUNG1 ; SANG CHUL LIM1 ; OH, Ji-Young1 ; BOCK SOON NA1 ; SANG SEOK LEE1 ; HYE YONG CHU1 ; JAE BON KOO1
[1] Next Generation Display Research Department, Electronics and Telecommunications Research Institute (ETRI), Daejeon 305-700, Korea, Republic of - Source
Journal of micromechanics and microengineering (Print). 2013, Vol 23, Num 12 ; 127002.1-127002.7 ; ref : 32 ref
- ISSN
- 0960-1317
- Domaine scientifique
- Electronics; Mechanical engineering
- Editeur
- Institute of Physics, Bristol
- Pays de publication
- United Kingdom
- Type de document
- Article
- Langue
- English
- Mot clé (fr)
- Bobine Charge cyclique Concentration contrainte Conductivité électrique Cuivre Dimensionnalité Dépôt électrolytique Etirabilité Interconnexion Résistance mécanique Siloxane(diméthyl) polymère
- Mot clé (en)
- Coil Cyclic load Stress concentration Electrical conductivity Copper Dimensionality Electrodeposition Stretchability Interconnection Strength Dimethylsiloxane polymer
- Mot clé (es)
- Bobina Carga cíclica Concentración restringida Conductividad eléctrica Cobre Dimensionalidad Depósito electrolítico Estirabilidad Interconexión Resistencia mecánica Siloxano(dimetil) polímero
- Classification
- Pascal
- 001 Sciences exactes et technologie / 001D Sciences appliquees / 001D03 Electronique / 001D03F Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide / 001D03F01 Interfaces
- Discipline
- Electronics
- Provenance
- Inist-CNRS
- Base de données
- PASCAL
- Identifiant INIST
- 28046534
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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