Crisis in technology : the questionable U.S. ability to manufacture thin-film multichip modules : Multichip module technology
- Auteur
- BALDE, J. W
Interconection Decision Consulting, Flemington NJ 08822, United States - Source
Proceedings of the IEEE. 1992, Vol 80, Num 12, pp 1995-2002 ; ref : 6 ref
- CODEN
- IEEPAD
- ISSN
- 0018-9219
- Domaine scientifique
- Electronics; Computer science; Telecommunications
- Editeur
- Institute of Electrical and Electronics Engineers, New York, NY
- Pays de publication
- United States
- Type de document
- Article
- Langue
- English
- Mot clé (fr)
- Conception Couche mince Coût Multiprocesseur Puce électronique
- Mot clé (en)
- Design Thin film Costs Multiprocessor Chip
- Mot clé (es)
- Diseño Capa fina Costo Multiprocesador Pastilla electrónica
- Classification
- Pascal
- 001 Sciences exactes et technologie / 001D Sciences appliquees / 001D03 Electronique / 001D03J Matériel informatique / 001D03J01 Généralités
- Discipline
- Electronics
- Provenance
- Inist-CNRS
- Base de données
- PASCAL
- Identifiant INIST
- 4559751
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
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DOI
10.1109/5.192077 
https://dx.doi.org/10.1109/5.192077
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